Laird Releases New Range of Thermoelectric Coolers for Outdoor Security Cameras

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MORRISVILLE, N.C. — Laird Thermal Systems announces the release of the HiTemp ETX Series thermoelectric coolers, which are said to be able to survive in temperatures up to 302°F, making them well-suited for spot cooling in outdoor security camera applications.

Laird says imaging sensors and other sensitive camera components such as FPGA’s require active cooling to keep operating temperatures below their maximum limit, ensuring high-quality image resolution.

Due to solar radiation and increased heat flux density from surrounding electronics, outdoor security cameras can reach temperatures up to 194°F. This may cause performance degradation, loss of image resolution or even system failure, according to the company.

Thermoelectric coolers such as the HiTemp ETX Series are solid-state devices that use the Peltier effect to actively pump heat away from electronic devices requiring cooling.

Because standard thermoelectric coolers were not designed for high temperature environments, Laird developed a new generation of thermoelectric coolers to improve reliability and cooling performance.

The new HiTemp ETX Series has a robust construction and is assembled with advanced thermoelectric materials that boosts cooling capacity by up to 10%. It also features a higher insulating barrier compared to standard thermoelectric coolers, achieving a temperature differential of up to 181°F, according to the company.

“The HiTemp ETX Series is our latest thermoelectric product offering that is specifically designed for emerging spot cooling applications in high temperature environments,” says Andrew Dereka, product director at Laird Thermal Systems. “This product series uses the latest thermoelectric materials and robust construction to assure long life operation in many critical applications such as imaging in outdoor environments.”

The HiTemp ETX Series is available in more than 50 models to cover the wide range of emerging applications and support unique footprint requirements, cooling capacity needs, voltage inputs and finishing options.

Click here for an example of a real-world application.

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